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Recently, the global Electronics Manufacturing Services (EMS) and Original Design Manufacturing (ODM) sectors have shown a stark "two‑speed development" trend. On one hand, prolonged weak demand for consumer electronics has put revenue pressure on manufacturers reliant on traditional products such as smartphones and personal computers. On the other hand, robust demand in emerging areas including AI servers, automotive electronics and energy infrastructure has opened new growth opportunities for leading enterprises with solid technical reserves and rapid response capabilities. This structural differentiation is profoundly driving the reshaping of industry landscape and shift of core competitiveness.
Competition in electronics manufacturing is no longer limited to cost and scale. Industry leaders are building future‑oriented manufacturing capabilities through in‑depth integration of advanced technologies.
Deep integration of intelligent manufacturing and digital twin has become a key trend. For instance, global EMS giant Foxconn recently unveiled an upgraded advanced manufacturing system at its Lighthouse Factory. The system not only realizes full‑process data visualization and adaptive optimization for Surface Mount Technology (SMT) production lines, but also applies digital twin technology to the New Product Introduction (NPI) phase. During pilot production of next‑generation AI server motherboards, engineers can fully simulate assembly workflows, predict potential interferences and optimize processes in a virtual environment, cutting the commissioning cycle of physical production lines by over 40%. This marks that electronics manufacturing is accelerating its shift from experience‑driven to data‑and‑simulation‑driven development.
Soaring demand for advanced packaging and system‑level integration compels manufacturers to expand upstream capabilities. As chip performance nears physical limits, boosting system performance via advanced packaging technologies (such as 2.5D/3D packaging and Chiplet) has become a mainstream approach. This requires continuous investment from Outsourced Semiconductor Assembly and Test (OSAT) players including ASE Group and JCET Group. It also pushes high‑end server ODM manufacturers like Quanta and Inventec to conduct unprecedented early co‑design with chip design firms and OSAT companies. The value of manufacturing is extending from pure assembly to system‑level engineering solutions covering interconnection design, thermal management and signal integrity optimization.
In the past few years, the "China‑plus‑one" or regional diversification strategy was largely a theoretical discussion, yet it has now fully entered substantial layout and capacity deployment. Driven by both supply chain resilience requirements amid geopolitical tensions and economic considerations of end‑market proximity and logistics cost optimization, the shift is accelerating.
Southeast Asia and Mexico have become two hotspots for capacity relocation. Major Taiwan‑based manufacturers such as Pegatron and Wistron keep expanding production bases in Vietnam and India, with product lines extending from consumer electronics to networking equipment and automotive electronics. Benefiting from its proximity to the U.S. market and trade preferences under the United States‑Mexico‑Canada Agreement (USMCA), Mexico has attracted massive investment targeting North America. Jabil recently announced expansion of its plant in Chihuahua, Mexico, focusing on high‑reliability electronic modules for electric vehicles and medical devices. Such "plate movement" in capacity layout is not a simple relocation, but accompanied by complex challenges of supply chain localization, including local supplier cultivation, technical talent training and cultural integration.
Meanwhile, leading domestic Chinese electronics manufacturers keep advancing by stepping up investment in high‑end manufacturing and automation. Beyond consolidating its leading position in consumer electronics and cloud computing equipment manufacturing, Foxconn Industrial Internet exports its systematic capabilities in precision and intelligent manufacturing to new‑energy vehicle components and high‑end precision machine tools, exploring second and third growth drivers. Drawing on profound expertise in metal processing, glass‑ceramic technologies and electronic integration, BYD Electronics continuously expands its market share in high‑end structural parts for smartphones and tablets, while actively tapping into emerging smart hardware markets such as AR/VR and drones.
